The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2006
Filed:
Jun. 04, 2004
Takeshi Yoshimi, Osaka, JP;
Tetsuya Osawa, Osaka, JP;
Takeshi Yoshimi, Osaka, JP;
Tetsuya Osawa, Osaka, JP;
Nitto Denko Corporation, Ibaraki, JP;
Abstract
A wired circuit board is provided having enhanced reliability of electrical connection between a metal substrate and a shield layer to achieve significant noise reduction reliably. An insulating base layer is formed on the metal substrate, while resin layers are formed on the metal substrate with a predetermined space provided from the both widthwise sides of the insulating base layer. A conductor layer is formed having a predetermined wired circuit pattern on the insulating base layer. Thereafter, an insulating cover layer is formed on the insulating base layer in such a manner as to cover the conductor layer. Then, a shield layer is laminated on the metal substrate to cover the insulating cover layer and also is put in close contact with the resin layers at end portions thereof by a vacuum film-forming method or by plating.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile