The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2006

Filed:

Mar. 09, 2004
Applicant:

Tomoyuki Miyagawa, Nukata-gun, JP;

Inventor:

Tomoyuki Miyagawa, Nukata-gun, JP;

Assignee:

Denso Corporation, Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A circuit board includes a printed circuit board layer, an insulating layer, and an electromagnetic interference sealed layer. The printed circuit board layer includes an insulating substrate on which circuit patterns are printed. The insulating layer covers the circuit patterns. The sealed layer covers the insulating layer and connected with a ground portion of the circuit patterns. The sealed layer that is formed by screen printing conductive paste has through holes. Edges are formed around the through holes other than the outer edges, and a total area of edges at which the thickness of the printed conductive paste is large due to surface tension increases. Thus, the sealed layer can be easily formed in a predetermined thickness, and stability in conductivity of the sealed layer can be maintained.


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