The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2006

Filed:

Mar. 28, 2003
Applicants:

Shoji Obuchi, Ichihara, JP;

Nobuyuki Maki, Ichihara, JP;

Hitoshi Tachino, Ichihara, JP;

Inventors:

Shoji Obuchi, Ichihara, JP;

Nobuyuki Maki, Ichihara, JP;

Hitoshi Tachino, Ichihara, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 120/68 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided is a lactic acid-based resin composition that comprises a lactic acid-based resin (component (A)), and an ethylene-unsaturated carboxylic acid copolymer (component (B)) and/or an ethylene-unsaturated carboxylic acid copolymer ionomer (component (C)). The lactic acid-based resin composition has good physical properties in melt and can be efficiently formed into films and laminates through casting or extrusion lamination. The paper laminates obtained through extrusion lamination with the resin composition have good moisture barrier property, and have the advantages of good antibacterial ability, good biodegradability and low combustion heat. And the moldings obtained from the resin composition of the invention have a characteristic which is excellent in impact strength. Further, the films and sheets formed of the resin composition have good low-temperature heat-sealability and hot-tack sealability, and the resin composition well serves as a sealant. The resin composition is favorable to various materials in a broad range, for example, for wrapping and packaging materials for foods, drinks, electronic appliances, medicines and cosmetics, for materials for use in agriculture, civil engineering and construction and for materials for compost, etc.


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