The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2006

Filed:

Dec. 23, 2004
Applicants:

Thomas P. Brody, Pittsburgh, PA (US);

Joseph A. Marcanio, Latrobe, PA (US);

Jeffrey W. Conrad, Verona, PA (US);

Timothy A. Cowen, Lower Burrell, PA (US);

Inventors:

Thomas P. Brody, Pittsburgh, PA (US);

Joseph A. Marcanio, Latrobe, PA (US);

Jeffrey W. Conrad, Verona, PA (US);

Timothy A. Cowen, Lower Burrell, PA (US);

Assignee:

Advantech Global, Ltd, Tortola, VG;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract

Via holes are formed in a continuous inline shadow mask production system by depositing a first conductor layer and subsequently depositing a first insulator layer over a portion of the first conductor layer. The first insulator layer is deposited in a manner to define at least one notch along its edge. The second insulator layer is then deposited on another portion of the first conductor layer in a manner whereupon the second insulator layer slightly overlaps each notch of the first insulator layer, thereby forming the one or more via holes. A conductive filler can optionally be deposited in each via hole. Lastly, a second conductive layer can be deposited over the first insulator layer, the second insulator layer and, if provided, the conductive filler.


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