The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2006
Filed:
Jul. 23, 2004
Applicant:
Hironobu Sai, Kyoto, JP;
Inventor:
Hironobu Sai, Kyoto, JP;
Assignee:
Rohm Co., Ltd., Kyoto, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/36 (2006.01); H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of fabricating a compound semiconductor layer has steps of forming a first layer made of an oxidizable material on a substrate, forming a second layer made of a compound semiconductor on the first layer, oxidizing the first layer made of the oxidizable material to an oxide layer and forming a third layer made of compound semiconductor that constitutes a semiconductor element on the second layer.