The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2006
Filed:
Dec. 12, 2002
Applicants:
Kazuo Hokkirigawa, Yonezawa, JP;
Motoharu Akiyama, Nagano-ken, JP;
Morinobu Kawamura, Nagano-ken, JP;
Inventors:
Kazuo Hokkirigawa, Yonezawa, JP;
Motoharu Akiyama, Nagano-ken, JP;
Morinobu Kawamura, Nagano-ken, JP;
Assignee:
Minebea Co., Ltd., Kitasaku-gun, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/22 (2006.01);
U.S. Cl.
CPC ...
Abstract
A foam-molded synthetic resin material in which a RBC or CRBC fine powder and bubbles are homogeneously dispersed. There is provided an electrically conductive molded resin material of sufficient porosity by using a fine powder of RB ceramics (RBC) or CRB ceramics (CRBC), in which a surface thereof is not covered with a skin layer while an electrically conductive material is directly bared on the surface, and a method for preparing same and uses thereof.