The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2006

Filed:

May. 30, 2002
Applicants:

Eiji Ohta, Miyagi, JP;

Osamu Ishii, Kanagawa, JP;

Inventors:

Eiji Ohta, Miyagi, JP;

Osamu Ishii, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

An IC card having high reliability, which is not only in that printing can be surely conducted with respect to the reversible display layer provided on the surface of the card substrate, but also in that the IC chip is surely protected by the reinforcing sheet. An IC card which has: an IC module () including an IC chip () mounted on an insulating substrate (), and a reinforcing sheet () provided over the IC chip () through a sealing resin () for sealing the IC chip (); a card substrate () comprised of a resin for sealing the IC module (); and a reversible recording layer () provided on at least one surface of the card substrate (), wherein reinforcing film patterns (), (') having openings (), (′) which expose the IC chip () mounted portion are provided on at least one of the IC chip () mounted surface and the non-mounted surface of the insulating substrate ().


Find Patent Forward Citations

Loading…