The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2006

Filed:

Feb. 01, 2005
Applicants:

Eric C. Peterson, McKinney, TX (US);

Brent A. Boudreaux, Highland Village, TX (US);

Christian L. Belady, McKinney, TX (US);

Inventors:

Eric C. Peterson, McKinney, TX (US);

Brent A. Boudreaux, Highland Village, TX (US);

Christian L. Belady, McKinney, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21D 53/02 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A thermal interface pad is constructed from a plurality of thermal interface plate assemblies. Alternate thermal interface plate assemblies are rotated about 180 degrees from each other within the pad. Each plate assembly includes one or more spring members configured such that the completed thermal interface pad includes a plurality of spring members on at least two sides of the pad. The thermal interface plate assemblies are configured to allow the thermal interface pad to vary greatly in thickness. The pad is sufficiently adjustable in thickness to accommodate gross tolerance differences between multiple heat generating and sinking devices. Rods inserted in openings in the plates may be used to align the plate assemblies and to apply compressive force to the plates, improving the thermal conductivity between adjacent plates and greatly decreasing the overall thermal resistance of the thermal interface pad.


Find Patent Forward Citations

Peterson, Eric. (2006). Mechanical highly compliant thermal interface pad (U.S. Patent No. 7131199). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7131199

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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