The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2006
Filed:
Aug. 14, 2003
Amar Guettaf, Sunnyvale, CA (US);
Amar Guettaf, Sunnyvale, CA (US);
Broadcom Corporation, Irvine, CA (US);
Abstract
The present invention is directed to circuits and methods to efficiently conduct scan testing of integrated circuits in which first level packaging is varied to provide different versions of the integrated circuit. An integrated circuit is provided that includes at least one bond pad test circuit. The bond pad test circuit is coupled between a bond pad and functional components within an integrated circuit. In one embodiment, the bond pad test circuit includes a multiplexer and a D flip-flop in which the D input of the flip-flop is coupled to a bond pad. In another embodiment, the bond pad test circuit includes a multiplexer and a D flip-flop in which the D input of the flip-flop is coupled to the output of the multiplexer. A method for scan testing using an integrated circuit with a bond pad test circuit is also provided.