The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2006

Filed:

Jun. 08, 2004
Applicants:

Wen-yen Lin, Taoyuan, TW;

Tsan-nan Chien, Taipei, TW;

Chun-wen Pai, Jhonghe, TW;

Inventors:

Wen-Yen Lin, Taoyuan, TW;

Tsan-Nan Chien, Taipei, TW;

Chun-Wen Pai, Jhonghe, TW;

Assignee:

Quanta Computer Inc., Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A function module with built-in heat dissipation device. The function module includes a first circuit board, a second circuit board, a first height-compensation heat spreader, a second height-compensation heat spreader, and a heat dissipation fin. The first circuit board has a first surface, a first and second device. The second circuit board has a second surface facing the first surface, a third device, and a fourth device. The first height-compensation heat spreader has a first face, contacting the first and second devices simultaneously, and a third face, opposite to the first face. The second height-compensation heat spreader has a second face, contacting the third and fourth devices simultaneously, and a fourth face, opposite to the second face. The heat dissipation fin is disposed between the first circuit board and the second circuit board.


Find Patent Forward Citations

Loading…