The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2006
Filed:
May. 23, 2002
Miyoshi Togawa, Oita, JP;
Miyoshi Togawa, Oita, JP;
Sony Corporation, , JP;
Abstract
A lead frame comprises a lead frame body having cut-away portions cut away from the side surfaces of the lead frame body, a die pad for securing a semiconductor chip, bonding electrodes surrounding the die pad, external electrodes for allowing the lead frame to be mounted, wiring for surface treatment extending on the lead frame body with its end being located at a portion of each of the side surfaces of the lead frame body, the portion being opposed to the cut-away portions. The bonding electrode and the wiring for surface treatment, as well as the external electrode and the wiring for surface treatment, are electrically connected, respectively. Even when the lead frame is electrostatically charged by friction with a transfer unit, the semiconductor chip on the lead frame avoids electrostatic damage.