The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2006

Filed:

Sep. 25, 2003
Applicants:

Stefan Bader, Eilsbrunn, DE;

Dominik Eisert, Regensburg, DE;

Berthold Hahn, Hemau, DE;

Stephan Kaiser, Regensburg, DE;

Inventors:

Stefan Bader, Eilsbrunn, DE;

Dominik Eisert, Regensburg, DE;

Berthold Hahn, Hemau, DE;

Stephan Kaiser, Regensburg, DE;

Assignee:

Osram GmbH, Munich, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Semiconductor chip which emits electromagnetic radiation, and method for fabricating it. To improve the light yield of semiconductor chips which emit electromagnetic radiation, a textured reflection surface () is integrated on the p-side of a semiconductor chip. The semiconductor chip has an epitaxially produced semiconductor layer stack () based on GaN, which comprises an n-conducting semiconductor layer (), a p-conducting semiconductor layer () and an electromagnetic radiation generating region () which is arranged between these two semiconductor layers (). The surface of the p-conducting semiconductor layer () which faces away from the radiation-generating region () is provided with three-dimensional pyramid-like structures (). A mirror layer () is arranged over the whole of this textured surface. A textured reflection surface () is formed between the mirror layer () and the p-conducting semiconductor layer (). The textured reflection surface () can increase the amount of light which is decoupled at the radiation-outcoupling surface () by virtue of the fact that a beam (), after double reflection on the reflection surface (), is more likely not to be totally reflected.


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