The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2006

Filed:

Jun. 20, 2005
Applicants:

Masahiko Itakura, Tokyo, JP;

Hiroshi Sagane, Osaka, JP;

Yuichi Oe, Osaka, JP;

Inventors:

Masahiko Itakura, Tokyo, JP;

Hiroshi Sagane, Osaka, JP;

Yuichi Oe, Osaka, JP;

Assignee:

Daicel Polymer Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/00 (2006.01); B32B 37/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a joining method using a method of laser welding wherein two resin molded bodies can be joined with high welding strength. Specifically, this is a method that joins two thermoplastic resin molded bodies using a method of laser welding; the first resin molded body is a laser light transmissive molded body comprising a thermoplastic resin and cellulose fibers with an α-cellulose content of 80% or more; the second resin molded body is a laser light absorbent molded body containing a thermoplastic resin and a colorant; and the first resin molded body and the second resin molded body are welded by irradiating laser light from the first resin molded body side.


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