The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2006
Filed:
Sep. 08, 2004
Kazutoshi Ishii, Chiba, JP;
Jun Osanai, Chiba, JP;
Yuichiro Kitajima, Chiba, JP;
Yukimasa Minami, Chiba, JP;
Keisuke Uemura, Chiba, JP;
Miwa Wake, Chiba, JP;
Kazutoshi Ishii, Chiba, JP;
Jun Osanai, Chiba, JP;
Yuichiro Kitajima, Chiba, JP;
Yukimasa Minami, Chiba, JP;
Keisuke Uemura, Chiba, JP;
Miwa Wake, Chiba, JP;
Seiko Instruments Inc., , JP;
Abstract
A manufacturing method for a semiconductor device which is capable of manufacturing the semiconductor device with a high quality in high yields while reducing variations in electric characteristic is disclosed. The manufacturing method according to the present invention includes a main body wafer manufacturing process for manufacturing a wafer on which a semiconductor device to be completed as a product is formed and a monitor wafer manufacturing process for manufacturing a wafer on which a monitor element is formed, the processes sharing a monitoring step alone, the main body wafer manufacturing process including a variation reduction step, the monitor wafer manufacturing process including a quality check step and a condition setting step.