The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2006

Filed:

Feb. 15, 2002
Applicants:

Ichiro Ishii, Wako, JP;

Taizou Kitamura, Wako, JP;

Tokiyuki Wakayama, Wako, JP;

Koji Yamaguchi, Wako, JP;

Inventors:

Ichiro Ishii, Wako, JP;

Taizou Kitamura, Wako, JP;

Tokiyuki Wakayama, Wako, JP;

Koji Yamaguchi, Wako, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21D 13/02 (2006.01); B21D 37/00 (2006.01); B21J 13/03 (2006.01);
U.S. Cl.
CPC ...
Abstract

A pressing apparatus includes a lower die () fixed to a lower plate (), and first and second plate (), and first and second upper die punches (and) capable of being lifted and lowered along with an upper plate (). The first upper die punch () supported by a spring () is capable of being lifted and lowered relative to the second upper die punch (). The upper plate () is lifted and lowered, while intermittently feeding a band-shaped work (W) one pitch by one pitch from the right to the left along an upper surface of the lower die (), thereby pressing the work (W) to form grooves in the work (W) continuously. When the groove is formed in the work (W) by pressing the work (W) by the second upper die punch (), the groove formed at the last time by pressing the work (W) by the second upper die punch () is retained and positioned between the first upper die punch () and the lower die (). Therefore, the formation of the grove by the second upper die punch () can be carried out accurately.


Find Patent Forward Citations

Loading…