The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2006
Filed:
Nov. 19, 2004
Jeffery B. Moler, Sarasota, FL (US);
Aaron Dickey, Sarasota, FL (US);
Keith Thornhill, Sarasota, FL (US);
Jeffery B. Moler, Sarasota, FL (US);
Aaron Dickey, Sarasota, FL (US);
Keith Thornhill, Sarasota, FL (US);
Viking Technologies, L.C., Sarasota, FL (US);
Abstract
The present invention includes a method of compensating for differences in the rate of thermal expansion in one or more elements of an electro-mechanical actuator. The electro-mechanical actuator can include one or more elements such as a piezoelectric ceramic multilayer actuator (CMA) and a mechanism to amplify the motion of the CMA. A difference in the rate of thermal expansion or coefficient of thermal expansion, CTE, between the materials in the CMA and the amplifying mechanism can cause the two components to vary in size at differing rates as the ambient temperature varies. Since the amplifying mechanism provides substantial amplification of the motion of the CMA, the relative variation in size of the components due to temperature can be translated by the amplifying mechanism as motion of the CMA. This can result in substantial motion of the amplifying mechanism. Replacing a mechanical element in the amplifying mechanism with an element having a different value for the CTE substantially reduces the difference in CTE of the materials, thereby reducing the thermally induced motion of the amplifying mechanism. Further, the material used and the means of interconnecting the replacement element in the amplification device for thermal compensation can maintain high rigidity of the CMA support structure, since the support structure transmits the motion and force of the CMA to the amplifying mechanism as well as applying a compressive preload to the CMA. Further, a high level of compressive preload force can be used as an additional part of the overall design process to adjust the degree of thermal compensation required.