The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2006

Filed:

Feb. 10, 2004
Applicants:

Keiji Ogawa, Fukui, JP;

Mitsuhide Kato, Sabae, JP;

Yoshinori Yamada, Takefu, JP;

Inventors:

Keiji Ogawa, Fukui, JP;

Mitsuhide Kato, Sabae, JP;

Yoshinori Yamada, Takefu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02G 3/08 (2006.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated electronic component includes a ceramic substrate incorporating circuit elements and/or having circuit elements mounted thereon, and a metal case mounted on the ceramic substrate. Notches are formed in substrate-facing segments of the metal case at the positions opposing the corners of the top surface of the ceramic substrate. The notches have a tapered shape having obtuse angles with respect to the top surface of the substrate. The notches may have a substantially circular arc shape. The substrate-facing segments having the notches are seamlessly connected to side segments of the metal case, bent in the vicinity of the notches, and supported by the bent portions in a cantilevered fashion.


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