The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2006
Filed:
Mar. 04, 2005
Applicants:
Takaaki Domon, Tokyo, JP;
Toshiyuki Nagatsuka, Tokyo, JP;
Tsutomu Yasui, Tokyo, JP;
Ryoichi Kondo, Tokyo, JP;
Inventors:
Takaaki Domon, Tokyo, JP;
Toshiyuki Nagatsuka, Tokyo, JP;
Tsutomu Yasui, Tokyo, JP;
Ryoichi Kondo, Tokyo, JP;
Assignee:
TDK Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
Abstract
A circuit device includes at least one under bump metal formed on a surface of a substrate and a connection bump provided on the uppermost layer of the under bump metal. At least one laminated metallic film is formed on part of or all of wiring pattern formed on the surface of the substrate, so that the laminated metallic film formed consists of the same material and has the same thickness as the under bump metal.