The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2006
Filed:
Apr. 25, 2005
John F. Casey, Colorado Springs, CO (US);
Lewis R. Dove, Monument, CO (US);
Ling Liu, Colorado Springs, CO (US);
James R. Drehle, Colorado Springs, CO (US);
R. Frederick Rau, Jr., Colorado Springs, CO (US);
Rosemary O. Johnson, Colorado Springs, CO (US);
Julius Botka, Santa Rosa, CA (US);
John F. Casey, Colorado Springs, CO (US);
Lewis R. Dove, Monument, CO (US);
Ling Liu, Colorado Springs, CO (US);
James R. Drehle, Colorado Springs, CO (US);
R. Frederick Rau, Jr., Colorado Springs, CO (US);
Rosemary O. Johnson, Colorado Springs, CO (US);
Julius Botka, Santa Rosa, CA (US);
Agilent Technologies, Inc., Palo Alto, CA (US);
Abstract
In a method for making a microwave circuit, a first dielectric is deposited over a ground plane, and then a conductor is formed on the first dielectric. A second dielectric is then deposited over the conductor and first dielectric, thereby encapsulating the conductor between the first and second dielectrics. In one embodiment, a ground shield layer is formed over the first and second dielectrics by 1) precoating the first and second dielectrics with a metallo-organic layer, and then 2) depositing a thickfilm ground shield layer over the precoat layer. Alternately, a ground shield layer is formed over the first and second dielectrics by 1) placing a polymer screen over the first and second dielectrics, and applying pressure to the polymer screen until it at least partially conforms to a contour of the dielectrics, and then 2) printing a thickfilm ground shield layer through the polymer screen.