The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7125746 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 24, 2006

Filed:

Nov. 05, 2004
Applicant:

Kwei Chung LI, Hong Kong, CN;

Inventor:

Kwei Chung Li, Hong Kong, CN;

Assignee:

MiniLogic Device Corporation Ltd., New Territories, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic device including a multi-chip die and a substrate member, said multi-chip die includes a plurality of integrated circuit chips which are integrally formed on the multi-chip die as a unitary member, each the integrated chip includes a plurality of electrodes for making external electrical contacts, the substrate member includes a circuit of a pre-determined pattern and a plurality of electric contacts disposed for making corresponding electrical connections with the electrodes of the integrated chips of the multi-chip die, the plurality of integrated circuit chips of the multi-chip die being connected as a unitary member to the substrate member.


Find Patent Forward Citations

Li, Kwei. (2006). Flip-chip sub-assembly, methods of making same and device including same (U.S. Patent No. 7125746). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7125746

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…