The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2006
Filed:
Nov. 13, 2001
Kiyohito Okamura, Osaka, JP;
Masaki Narisawa, Osakasayama, JP;
Masaki Nishioka, Nabari, JP;
Takaaki Dohmaru, Kawachinagano, JP;
Kunio Oka, Sakai, JP;
Yutai Katoh, Otsu, JP;
Akira Kohyama, Kyoto, JP;
Kiyohito Okamura, Osaka, JP;
Masaki Narisawa, Osakasayama, JP;
Masaki Nishioka, Nabari, JP;
Takaaki Dohmaru, Kawachinagano, JP;
Kunio Oka, Sakai, JP;
Yutai Katoh, Otsu, JP;
Akira Kohyama, Kyoto, JP;
Japan Science and Technology Corporation, Saitama-ken, JP;
Abstract
A mixed polymer liquid is prepared by mixing a polycarbosilane-dissolved organic solvent with poly(methylsilane) and moderated to viscosity of 5–20 Pa·s by heat-treatment to promote partial cross-linking reaction. The mixed-polymer is then melt-spun to fiber at 250–350° C. The fiber is cured by treatment at 100–200° C. in an oxidizing atmosphere, and baked at 1000° C. or higher. Due to thermosetting action of poly(methylsilane), the mixed polymer liquid is continuously melt-spun without breakage, and SiC fiber produced in this way is useful for reinforcement of SiC composite excellent in toughness, strength and heat-resistance.