The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2006
Filed:
Mar. 26, 2004
Yoji Hata, Tateyama, JP;
Yoji Hata, Tateyama, JP;
UMC Japan, Tateyama, JP;
Abstract
The present invention provides an LSI inspection method and a defect inspection data analysis apparatus capable of shortening a time needed for a wafer test. In a first databaseis stored inspection data obtained when each defect inspection apparatusinspects a wafer for defects in the front-end process. In a second databaseare stored non-conforming article judgment criteria for each predetermined type of defect, according to which a non-conforming chip is judged. A defective chip identifying portionidentifies a chip having a defect and identifies the type of defect for each defect that the identified chip has, on the basis of the inspection data. For each identified chip, a non-conforming chip judging portionjudges whether the chip is a non-conforming article or not according to the non-conforming article judgment criteria corresponding to the type of defect for each defect, and obtains position information within the wafer surface of a chip judged as being a non-conforming article. The position information thus obtained is transmitted to an LSI inspection apparatusvia a transmission portion