The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2006
Filed:
Mar. 04, 2005
Applicants:
Atsuhiko Sugimoto, Aichi, JP;
Hajime Saiki, Aichi, JP;
Inventors:
Atsuhiko Sugimoto, Aichi, JP;
Hajime Saiki, Aichi, JP;
Assignee:
NGK Spark Plug Co., Ltd., Aichi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A wiring substrate incorporating nickel-plated copper terminal pads for solder bumps, wherein a nickel plating layer constituting the nickel plated copper terminal pads has a phosphorus content of 8.5 to 15.0% by mass and is covered with a gold plating layer.
Sugimoto, Atsuhiko. (2006). Wiring substrate and process for manufacturing the same (U.S. Patent No. 7122894). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7122894
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile