The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2006

Filed:

Mar. 29, 2005
Applicants:

Ichiro Egawa, Tenri, JP;

Yukihisa Orisaka, Nabari, JP;

Inventors:

Ichiro Egawa, Tenri, JP;

Yukihisa Orisaka, Nabari, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01); H01L 23/52 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device is arranged so as to include (i) a wire L, connected directly to an LSI chip, which serves as a VGL wire for supplying a voltage VGL to the LSI chip, and (ii) a wire LBconnected not directly to but to one of a pair of electrodes of a capacitor provided between the wire LBand a voltage VGH wire, each of the wire Land the wire LBincluding a voltage input terminal. This arrangement provides (i) a semiconductor device, including a built-in capacitor, which makes it possible to shorten time required in an electrical screening test (final test) so as to reduce cost, and (ii) an electrical inspection method of the semiconductor device.


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