The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2006
Filed:
Mar. 24, 2004
Applicants:
Sotaro Tsukamoto, Aichi, JP;
Satoru Kuromiya, Gifu, JP;
Nobuhiro Hanai, Aichi, JP;
Masato Hayashida, Gifu, JP;
Inventors:
Sotaro Tsukamoto, Aichi, JP;
Satoru Kuromiya, Gifu, JP;
Nobuhiro Hanai, Aichi, JP;
Masato Hayashida, Gifu, JP;
Assignee:
Sony Corporation, , JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 39/00 (2006.01); H01L 29/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A wiring board houses a bare radio-frequency IC. Shield wiring films are provided above and below the IC. A plurality of shield interlayer-connection conductor films, i.e., shield via-holes, is provided so as to surround the IC. The shield wiring films and the shield interlayer-connection conductor films define a shield cage, which can electrostatically shield the IC. Thus, there is no need to attach a shield cap.