The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2006
Filed:
Dec. 15, 2003
Applicants:
Mitsuhiko Ogihara, Hachioji, JP;
Hiroyuki Fujiwara, Hachioji, JP;
Masaaki Sakuta, Tokyo, JP;
Ichimatsu Abiko, Tokyo, JP;
Inventors:
Mitsuhiko Ogihara, Hachioji, JP;
Hiroyuki Fujiwara, Hachioji, JP;
Masaaki Sakuta, Tokyo, JP;
Ichimatsu Abiko, Tokyo, JP;
Assignee:
Oki Data Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor apparatus includes a substrate; an adhesion layer disposed on the substrate, the adhesion layer mainly consisting of semiconductor material; and at least one semiconductor thin film including at least one semiconductor device and bonded on the adhesion layer. The adhesion layer may be a polycrystalline silicon layer or an amorphous silicon layer.