The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2006

Filed:

Apr. 22, 2004
Applicant:

Hiroshi Nishizawa, Yokohama, JP;

Inventor:

Hiroshi Nishizawa, Yokohama, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/14 (2006.01); H01L 31/0203 (2006.01);
U.S. Cl.
CPC ...
Abstract

Light that has entered a lens held by a barrel portion of a three-dimensional circuit board transmitting virtually no visible light enters a semiconductor imaging device held inside the three-dimensional circuit board. On the side opposite to the barrel portion, the three-dimensional circuit board is provided with a flexible printed circuit for sending a signal to and receiving a signal from the semiconductor imaging device. The region of the flexible printed circuit facing the semiconductor imaging device has sufficient shielding characteristics in a range sensitive to light reception by the semiconductor imaging device. This makes it possible to provide a sufficient shield against a light beam entering from the back surface of the semiconductor imaging device, so that the image quality does not deteriorate even when a conventional shielding sheet is not used. Since the shielding sheet becomes unnecessary, it is possible to reduce the cost of the shielding sheet itself and the number of steps of bonding the shielding sheet. Furthermore, the thickness corresponding to the shielding sheet and the adhesive can be reduced.


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