The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2006

Filed:

Jul. 28, 2003
Applicants:

Young-joon Park, Plano, TX (US);

Srikanth Krishnan, Richardson, TX (US);

Inventors:

Young-Joon Park, Plano, TX (US);

Srikanth Krishnan, Richardson, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01); C25D 15/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An embodiment of the invention is a method of manufacturing copper interconnectson a semiconductor waferwhere an electroplating process is used to deposit a first layer of copper grainshaving an initial grain size and a second layer of copper grainshaving a different initial grain size.


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