The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2006
Filed:
Nov. 24, 2004
Applicant:
Kuo-tung Tiao, Hsin Chu, TW;
Inventor:
Kuo-Tung Tiao, Hsin Chu, TW;
Assignee:
Aiptek International, Inc., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract
A chip package assembly is produced by preparing a transparent substrate in advance, a chip is electrically connected to a circuit layout of the transparent substrate. Make sure an unoccupied layer is sealed between the transparent substrate and the chip, so as to form the chip package assembly. After the processes mentioned above are done, the chip package assembly can leave the clean room to run post-processes, such as die sawing, or camera module packaging.
Tiao, Kuo-Tung. (2006). Method for packaging chip and package assembly produced thereby (U.S. Patent No. 7122405). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7122405
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