The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2006
Filed:
Feb. 20, 2004
Youhei Nagahama, Aizuwakamatsu, JP;
Katsunori Wako, Aizuwakamatsu, JP;
Yuichi Asano, Aizuwakamatsu, JP;
Masanori Takahashi, Aizuwakamatsu, JP;
Haruo Kojima, Aizuwakamatsu, JP;
Masamichi Fujimoto, Aizuwakamatsu, JP;
Hiroshi Ohtsubo, Aizuwakamatsu, JP;
Yuki Yasuda, Aizuwakamatsu, JP;
Youhei Nagahama, Aizuwakamatsu, JP;
Katsunori Wako, Aizuwakamatsu, JP;
Yuichi Asano, Aizuwakamatsu, JP;
Masanori Takahashi, Aizuwakamatsu, JP;
Haruo Kojima, Aizuwakamatsu, JP;
Masamichi Fujimoto, Aizuwakamatsu, JP;
Hiroshi Ohtsubo, Aizuwakamatsu, JP;
Yuki Yasuda, Aizuwakamatsu, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
In a method of manufacturing a semiconductor device of the invention, a rigid substrate which supports one or more semiconductor elements on a surface of the substrate and is clamped between an upper mold and a lower mold of an encapsulation mold at a time of resin encapsulation is provided, so that a vent-end edge portion of the substrate corresponding to a vent end of the encapsulation mold has a thickness smaller than a thickness of other portions of the substrate. The substrate is disposed in the encapsulation mold, and resin is injected into a cavity between the upper mold and the substrate to encapsulate the semiconductor elements with the resin.