The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2006
Filed:
Sep. 17, 2004
Applicant:
André Hanke, Strausberg, DE;
Inventor:
André Hanke, Strausberg, DE;
Assignee:
Infineon Technologies AG, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
The invention relates to an interconnection for chip sandwich structures by means of which chips can be electrically and mechanically connected to one another face-to-face, and to a method for the production thereof. The invention is intended to create interconnections that can be produced more cost-effectively and more effectively. This is achieved by virtue of the fact that pin- or sleeve-shaped contact elements () are arranged between the chips (), which contact elements create an electrical and mechanical interconnection between the contact pads () of the semiconductor chips () and are soldered to the latter.