The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2006

Filed:

May. 14, 2003
Applicants:

L. James Lee, Columbus, OH (US);

Siyi Lai, Madison, WI (US);

Inventors:

L. James Lee, Columbus, OH (US);

Siyi Lai, Madison, WI (US);

Assignee:

The Ohio State University, Columbus, OH (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 37/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

A new resin gas-assisted injection technique, which can achieve both bonding and surface modification of microfluidic devices. A sealing resin is injected with a surface modification agent into the microfluidic platform to fill the micron and submicron sized channels and reservoirs, as well as the gap between the platform and the lid. A gas (e.g., air or nitrogen) is then injected to replace most of the resin inside the channels and reservoirs. The remaining resin is cured (fully or partially) by ultraviolet light. By applying a masking technique, local modification of the channel surface can also be achieved through this method. Also provided are methods and structures related to micro-fluidic devices.


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