The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2006

Filed:

Dec. 21, 2004
Applicants:

Jincheng Chen, Lee's Summit, MO (US);

Brian R. Lefebure, Lee's Summit, MO (US);

Inventors:

Jincheng Chen, Lee's Summit, MO (US);

Brian R. Lefebure, Lee's Summit, MO (US);

Assignee:

R&D Tool & Engineering Co., Lee's Summit, MO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/78 (2006.01);
U.S. Cl.
CPC ...
Abstract

Auxiliary end heating devices on an elongated, heated hot melt distribution manifold body assist in maintaining uniform temperatures throughout all portions and passageways of the manifold body. The heating devices preferably take the form of thick film electrical resistive heaters of plate-like construction. The end heaters are on their own control circuit separate and apart from the circuit for other heaters for remaining portions of the manifold body. Special isolating slots are formed in lower corners of the manifold body between supporting standoffs and overhead melt passageways in the manifold body.


Find Patent Forward Citations

Chen, Jincheng. (2006). Injection molding distribution manifold having improved end heaters (U.S. Patent No. 7121819). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7121819

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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