The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2006

Filed:

Feb. 27, 2004
Applicants:

Hiromichi Watanabe, Kobe, JP;

Shinichi Sugiura, Kobe, JP;

Takafumi Yasuhara, Kobe, JP;

Katsufumi Morimune, Kobe, JP;

Hideaki Kaino, Kobe, JP;

Nobuhiro Wada, Kobe, JP;

Masatsugu Oohara, Kobe, JP;

Inventors:

Hiromichi Watanabe, Kobe, JP;

Shinichi Sugiura, Kobe, JP;

Takafumi Yasuhara, Kobe, JP;

Katsufumi Morimune, Kobe, JP;

Hideaki Kaino, Kobe, JP;

Nobuhiro Wada, Kobe, JP;

Masatsugu Oohara, Kobe, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic control device enabling heat generated by a power module to be favorably radiated even in a high-temperature condition in an engine compartment. The unit includes a casing accommodating a control circuit substrate; a die-cast mounting plate forming a control circuit substrate support portion, a frame-like fitting member and an external mounting portion integrally together; and a metal substrate on which a power module is adhered. When the mounting plate is mounted on the wall of a transmission and the metal substrate is fitted in the opening in the bottom surface of the frame-like fitting member, a mounting surface in nearly the same plane is formed by the lower surface of the mounting plate and by the lower surface of the metal substrate permitting heat from the power module to be radiated to the wall.


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