The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2006
Filed:
Jun. 22, 2004
Isao Ochiai, Ota, JP;
Toshiyuki Take, Gunma, JP;
Tetsuya Fukushima, Fukaya, JP;
Sanyo Electric Co., Ltd., Saitama, JP;
Abstract
A semiconductor device () can include, e.g., a recessed portion () on the reverse surface () of an insulating resin () which is the mounting surface of the semiconductor device (). Additionally, on the outer peripheral surface of the recessed portion (), the exposed region of leads () and the reverse surface () of the insulating resin () form generally the same plane. This allows, e.g., a QFN semiconductor device () according to preferred embodiments herein to place dust particles in the recessed portion () even in the presence of dust particles such as crushed burr particles of the leads () or plastic burrs, thereby avoiding mounting deficiencies when mounting the semiconductor device.