The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2006
Filed:
Oct. 24, 2003
Edward B. Stokes, Charlotte, NC (US);
Mark P. D'evelyn, Niskayuna, NY (US);
Stanton E. Weaver, Northville, NY (US);
Peter M. Sandvik, Albany, NY (US);
Abasifreke U. Ebong, Clifton Park, NY (US);
Xian-an Cao, Clifton Park, NY (US);
Steven F. Leboeuf, Schenectady, NY (US);
Nikhil R. Taskar, Scarsdale, NY (US);
Edward B. Stokes, Charlotte, NC (US);
Mark P. D'Evelyn, Niskayuna, NY (US);
Stanton E. Weaver, Northville, NY (US);
Peter M. Sandvik, Albany, NY (US);
Abasifreke U. Ebong, Clifton Park, NY (US);
Xian-an Cao, Clifton Park, NY (US);
Steven F. LeBoeuf, Schenectady, NY (US);
Nikhil R. Taskar, Scarsdale, NY (US);
GELcore, LLC, Valley View, OH (US);
Abstract
A flip chip light emitting diode die (″) includes a light-transmissive substrate (″) and semiconductor layers (″) that are selectively patterned to define a device mesa (″). A reflective electrode (″) is disposed on the device mesa (″). The reflective electrode (″) includes a light-transmissive insulating grid () disposed over the device mesa (″), an ohmic material () disposed at openings of the insulating grid () and making ohmic contact with the device mesa (″), and an electrically conductive reflective film (″) disposed over the insulating grid () and the ohmic material (). The electrically conductive reflective film (″) electrically communicates with the ohmic material ().