The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2006
Filed:
Feb. 10, 2005
Takashi Matsuoka, Sagamihara, JP;
Kiyokazu Mori, Atsugi, JP;
Yoshiki Seto, Hiratsuka, JP;
Tsunetaka Takeuchi, Isehara, JP;
Takahiko Kanai, Hadano, JP;
Takashi Matsuoka, Sagamihara, JP;
Kiyokazu Mori, Atsugi, JP;
Yoshiki Seto, Hiratsuka, JP;
Tsunetaka Takeuchi, Isehara, JP;
Takahiko Kanai, Hadano, JP;
Nissan Motor Co., Ltd., Yokohama, JP;
Neturen Co., Ltd., Tokyo, JP;
Abstract
A liquid phase diffusion bonding method for dissimilar metal sheets by allowing a galvanized steel sheet and an aluminum alloy sheet to come into close contact with each other and pressing both sheets by using a first mold of a liquid phase diffusion bonding apparatus and a second mold of the same; and heating the sheets at approximately the same heat-up rate and at approximately the same temperature to perform liquid phase diffusion bonding of the sheets by using induction heat generated by applying high frequency currents to a first high frequency induction heating coil provided on the first mold and a second high frequency induction heating coil provided on the second mold. The first high frequency induction heating coil and the second high frequency induction heating coil are positioned to sandwich the sheets at predetermined distances from the sheets, respectively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile