The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2006
Filed:
Dec. 20, 2004
Baomin Xu, Cupertino, CA (US);
Steven A. Buhler, Sunnyvale, CA (US);
William S. Wong, San Carlos, CA (US);
Michael C. Weisberg, Woodside, CA (US);
Scott E. Solberg, Mountain View, CA (US);
Karl A. Littau, Palo Alto, CA (US);
Scott A. Elrod, La Honda, CA (US);
Baomin Xu, Cupertino, CA (US);
Steven A. Buhler, Sunnyvale, CA (US);
William S. Wong, San Carlos, CA (US);
Michael C. Weisberg, Woodside, CA (US);
Scott E. Solberg, Mountain View, CA (US);
Karl A. Littau, Palo Alto, CA (US);
Scott A. Elrod, La Honda, CA (US);
Palo Alto Research Center Incorporated, Palo Alto, CA (US);
Abstract
A method for producing a detection/test tape includes depositing a material onto a surface of at least one first substrate to form a plurality of element structures. Electrodes are deposited on a surface of each of the plurality of element structures, and the element structures are bonded to a second substrate, where the second substrate is conductive or has a conductive layer, and the second substrate is carried on a carrier plate. The at least one first substrate is removed from the element structures and second side electrodes are deposited on a second surface of each of the plurality of element structures. An insulative material is inserted around the element structures to electrically isolate the two substrates used to bond the element structures. A second side of the element structures is then bonded to another substrate, where the other substrate is conductive or has a conductive layer. Thereafter, the carrier plate carrying the second substrate is removed.