The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2006
Filed:
Feb. 14, 2003
Kazuyoshi Honda, Takatsuki, JP;
Noriyasu Echigo, Kobe, JP;
Masaru Odagiri, Kawanishi, JP;
Takanori Sugimoto, Matsue, JP;
Kazuyoshi Honda, Takatsuki, JP;
Noriyasu Echigo, Kobe, JP;
Masaru Odagiri, Kawanishi, JP;
Takanori Sugimoto, Matsue, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
Electrode layers () are arranged on both sides of a dielectric layer () facing each other so as to configure a capacitor. Lead electrodes () are formed in the electrode layers (). A penetrating electrode () that is insulated from the electrode layers () is formed. An electronic component () configured in this manner is mounted on a wiring board, and a semiconductor chip can be mounted thereon. Along with connecting the semiconductor chip to the wiring board via the penetrating electrode (), the semiconductor chip or the wiring board is connected to the lead electrodes (). In this manner, while suppressing the size increase of a mounted area, the capacitor or the like can be arranged near the semiconductor chip. Thus, the semiconductor chip is driven with high frequency more easily.