The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2006
Filed:
Jul. 07, 2000
Applicants:
Yasuhiro Yoneda, Wakayama, JP;
Ryoichi Hashimoto, Wakayama, JP;
Inventors:
Yasuhiro Yoneda, Wakayama, JP;
Ryoichi Hashimoto, Wakayama, JP;
Assignee:
Kao Corporation, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09K 13/00 (2006.01); C09K 13/04 (2006.01); C09K 13/06 (2006.01); H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract
A polishing liquid composition is applicable as a means of forming embedded metal interconnections on a semiconductor substrate. In a surface to be polished comprising an insulating layer and a metal interconnection layer, the polishing liquid composition is capable of maintaining a polishing speed of the metal layer, of suppressing an etching speed, and of preventing dishing of the metal layer.