The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2006
Filed:
Jan. 03, 2005
Hamid R. Borzabadi, Noblesville, IN (US);
Dennis M. Koglin, Carmel, IN (US);
Stephen P. Long, Tipton, IN (US);
Timothy A. Vas, Kokomo, IN (US);
Hamid R. Borzabadi, Noblesville, IN (US);
Dennis M. Koglin, Carmel, IN (US);
Stephen P. Long, Tipton, IN (US);
Timothy A. Vas, Kokomo, IN (US);
Delphi Technologies, Inc., Troy, MI (US);
Abstract
A technique for manufacturing an integrated pressure sensor includes a number of steps. Initially, a substrate with conductive electrical traces located on first and second sides of the substrate is provided. A plurality of compensation circuits are positioned in an array on the first side of the substrate in electrical contact with one or more of the conductive electrical traces on the first side of the substrate. A plurality of pressure sensors are positioned on the second side of the substrate in electrical contact with one or more of the conductive electrical traces on the second side of the substrate. Each one of the sensors is associated with one of the compensation circuits to form a plurality of pressure sensor-compensation circuit pairs. The substrate includes conductive vias to electrically connect each of the sensor-compensation circuit pairs. Each of the compensation circuits provides temperature compensation for an associated one of the sensors. The sensor-compensation circuit pairs are calibrated and singulated for final packaging.