The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2006
Filed:
Aug. 11, 2004
Applicants:
Ken-ichi Ogura, Tokyo, JP;
Seizo Ueno, Tokyo, JP;
Toshiyuki Hosokawa, Tokyo, JP;
Yoshiya Eda, Tokyo, JP;
Inventors:
Ken-ichi Ogura, Tokyo, JP;
Seizo Ueno, Tokyo, JP;
Toshiyuki Hosokawa, Tokyo, JP;
Yoshiya Eda, Tokyo, JP;
Assignee:
Furukawa-Sky Aluminum Corp., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B21C 23/20 (2006.01); B21C 35/04 (2006.01);
U.S. Cl.
CPC ...
Abstract
An impact extrusion molded article that is molded while the metal-flow from a bottom of a slug set in a dice toward the side of the molded product article is suppressed; an impact extrusion molding method for manufacturing the impact extrusion molded article, and an impact extrusion molding apparatus used for the impact extrusion molding method, are provided.