The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2006
Filed:
May. 23, 2003
Jim D. Raby, Madison, AL (US);
Mark T. Mcmeen, Huntsville, AL (US);
Jason B. Gjesvold, Harvest, AL (US);
Casey L. Hatcher, Madison, AL (US);
Jim D. Raby, Madison, AL (US);
Mark T. McMeen, Huntsville, AL (US);
Jason B. Gjesvold, Harvest, AL (US);
Casey L. Hatcher, Madison, AL (US);
STI Electronics, Inc., Madison, AL (US);
Abstract
Integrated circuit components are imbedded within a laminate substrate disposed on a thermally conductive core, which provides a thermal sink. The circuit components are electrically connected to the integrated circuit via flexible electrical interconnects such as flexible wire bonds. An electrically insulating coating, is deposited upon the flexible electrical interconnects and upon the exposed surfaces of the integrated circuit assembly. The coating provides rigidity, an electrically insulating barrier and a first environmental barrier for preventing contamination of the exposed surfaces of the integrated circuit assembly. A thermally conductive encapsulating material, such as silicon gel, encases the circuit components and the flexible electrical interconnects within a rigid or semi-rigid matrix. The encapsulating material provides additional mechanical support, a second environmental and a thermal sink for dissipation of heat.