The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2006
Filed:
Aug. 13, 2004
Shih-chang Shei, Tainan County, TW;
Yen-wei Chen, Tainan County, TW;
Wei-shou Chen, Tainan County, TW;
Chia-sheng Chang, Tainan County, TW;
Hsin-ming Lo, Tainan County, TW;
Chien-fu Shen, Tainan County, TW;
Shih-Chang Shei, Tainan County, TW;
Yen-Wei Chen, Tainan County, TW;
Wei-Shou Chen, Tainan County, TW;
Chia-Sheng Chang, Tainan County, TW;
Hsin-Ming Lo, Tainan County, TW;
Chien-Fu Shen, Tainan County, TW;
Epitech Technology Corporation, Tainan County, TW;
Abstract
A light-emitting diode (LED) is described. The light-emitting diode comprises a metal substrate, a reflective layer, a first transparent conductive layer, an illuminant epitaxial structure and a second transparent conductive layer stacked in sequence, and an electrode located on a portion of the second transparent conductive layer. A thickness of the metal substrate is between 30 μm and 150 μm. In addition, the light-emitting diode can further comprises a supporting substrate and an adhesive layer. The adhesive layer is located between the supporting substrate and the metal substrate to adhere the supporting substrate onto the metal substrate.