The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2006

Filed:

Aug. 19, 2005
Applicants:

Dong-woo Lee, Seoul, KR;

Jin-sung Lee, Seoul, KR;

Jong-kill Lim, Hwaseong-si, KR;

Bang-weon Lee, Seoul, KR;

Tae-sang Park, Suwon-si, KR;

Tae-gyu Kim, Hwaseong-si, KR;

Inventors:

Dong-woo Lee, Seoul, KR;

Jin-sung Lee, Seoul, KR;

Jong-kill Lim, Hwaseong-si, KR;

Bang-weon Lee, Seoul, KR;

Tae-sang Park, Suwon-si, KR;

Tae-gyu Kim, Hwaseong-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 3/68 (2006.01); C23C 16/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A wafer bake apparatus includes an air flow control unit of pneumatic cylinder structure operating interlockingly with a wafer lift unit and induces the air flow between a wafer and a hot plate. Therefore, when a wafer is placed in a baking position the air between the wafer and the hot plate descends. As a result, the wafer is no longer under the influence of air resistance, and can be more accurately placed in the baking position. In addition, when the baked wafer is lifted to an unloading position, the air between the hot plate and the wafer ascends, which in turn supports the wafer and prevents the distortion of the wafer.


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