The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2006
Filed:
Jul. 08, 2002
Kanji Shimo-ohsako, Settsu, JP;
Takashi Itoh, Otsu, JP;
Masaru Nishinaka, Otsu, JP;
Shigeru Tanaka, Settsu, JP;
Mutsuaki Murakami, Settsu, JP;
Kanji Shimo-Ohsako, Settsu, JP;
Takashi Itoh, Otsu, JP;
Masaru Nishinaka, Otsu, JP;
Shigeru Tanaka, Settsu, JP;
Mutsuaki Murakami, Settsu, JP;
Kaneka Corporation, Osaka, JP;
Abstract
The present invention provides a resin composition comprising a polyimide containing particular dianhydride and diamine, and an epoxy resin. The resin composition can be bonded at a relatively low temperature, has excellent heat resistance, adhesion property, soldering heat resistance and retaining ratio of peeling strength after PCT. By forming a circuit using the polyimide resin sheet or the polyimide resin sheet with metal foil, which comprises the resin composition, according to the semi-additive method, a printed wiring board having a good wiring shape, firm adhesion of circuit and high insulating resistance in the microcircuit space can be obtained.