The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2006
Filed:
Dec. 17, 2003
Amane Mochizuki, Osaka, JP;
Takahiro Fukuoka, Osaka, JP;
Mitsuhiro Kanada, Osaka, JP;
Takayuki Yamamoto, Osaka, JP;
Tomohiro Taruno, Osaka, JP;
Amane Mochizuki, Osaka, JP;
Takahiro Fukuoka, Osaka, JP;
Mitsuhiro Kanada, Osaka, JP;
Takayuki Yamamoto, Osaka, JP;
Tomohiro Taruno, Osaka, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
The present photosensitive resin compositioncomprises a polyamic acid resin, a photosensitive agent, a dispersible compounddispersible in the polyamic acid resin, and a solvent. The porous resin is obtained by removing the solvent from the photosensitive resin compositionto form a composition in which the dispersible compoundis dispersed in the polyamic acid resin, removing the dispersible compound to make the composition porous, and curing the porous photosensitive resin composition. The porous resin enables forming a fine circuit pattern and has a low dielectric constant and, when used as an insulating layer of a circuit board, brings about improved high frequency characteristics.