The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2006
Filed:
Apr. 16, 2004
Axel Brintzinger, Dresden, DE;
Octavio Trovarelli, Dresden, DE;
Axel Brintzinger, Dresden, DE;
Octavio Trovarelli, Dresden, DE;
Infineon Technologies AG, Munich, DE;
Abstract
The invention relates to a method for protecting the redistribution layer on wafers/chips, which preferably comprises a structure constructed from a seed layer, a layer of copper situated on the seed layer, a nickel layer arranged thereon, and a gold layer covering the latter. The wafer () provided with the redistribution layer () is covered on its entire surface with an organic protective layer (), e.g., made of BTA (benzotriazole), Glicoat or Preventol®, which protects the redistribution layer () from corrosion and oxidation in that it produces a dense covering of the metal surface of the redistribution layer () through chemical bonding.