The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2006
Filed:
Sep. 12, 2003
Wen Jin Meng, Baton Rouge, LA (US);
Wen Jin Meng, Baton Rouge, LA (US);
Board of Supervisors of Louisiana State University and Agricultural and Mechanical College, Baton Rouge, LA (US);
Abstract
An inexpensive method of rapidly fabricating reactive metal (Zn, Al, Al-alloy, etc.) microscale structures including high-aspect-ratio microscale structures is disclosed. A high precision process uses conformal bond inhibitor coating and high temperature compression molding techniques to produce high quality, high aspect ratio metal structures. In one embodiment, following fabrication of an initial metallic microscale mold insert, an adhesion-promoting metal precursor layer and a ceramic bond inhibitor coating are conformally deposited onto the microscale mold insert. The microscale mold insert and a preselected reactive metal are then heated to an optimum temperature and compressed together. The mold insert is then extracted from the molded metal to produce a reverse image of the mold insert.