The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2006
Filed:
Jun. 11, 2003
Dirk D. Brown, Mountain View, CA (US);
John D. Williams, Campbell, CA (US);
Dirk D. Brown, Mountain View, CA (US);
John D. Williams, Campbell, CA (US);
Neoconix, Inc., Sunnyvale, CA (US);
Abstract
A printed circuit board includes a dielectric layer and an area array of contact elements extending above a first surface of the dielectric layer. Each contact element includes a conductive portion disposed to engage a respective pad of a land grid array module for providing electrical connection to the land grid array module. The land grid array module can include a land grid array package or a second printed circuit board. In one embodiment, the contact elements are selected from the group of contact types including metal springs, bundled wires, metal in polymer, and solid metal tabs. In another embodiment, a contact element in the area array includes a base portion of conductive material and an elastic portion of conductive material formed integrally with the base portion whereby the elastic portion extends from the base portion and protrudes above the first surface of the dielectric layer.